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Part Number Description Manufacturer Price & Lead Time
CQ08E SMD REMOVAL ALLOY, WIRE; CLEANER TYPE:-; CLEANER APPLICATIONS:PCBS; PRODUCT RANGE:-; DISPENSING METHOD:-; VOLUME:-; WEIG... EMULATION Request Quote
CQ291E FLUX REMOVER, SYRINGE; CLEANER TYPE:FLUX REMOVER; DISPENSING METHOD:SYRINGE; SERIES:CHIPQUIK; VOLUME:10CC; LEADED PROCES... EMULATION Request Quote
H230303901705A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:20.1C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H250301903105A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:16.5C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H270305900005A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:15.5C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H350307903805A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:8.6C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H375307901505A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:7.5C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H400307904005A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:7.1C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H425309902005A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:5.6C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote
H450307901605A HEAT SINK; PACKAGES COOLED:BGA; THERMAL RESISTANCE:5.6C/W; EXTERNAL HEIGHT - METRIC:7.62MM; PEAK REFLOW COMPATIBLE (260... EMULATION Request Quote